Products

Latent Curing Agent

 

GRADE
Appearance
Average Partical Size (μm)(1)
Amine Value
Softing Point (℃) (3)
Characteristics & Application
Technical
File
FUJICURE FXR-1020
white powder
3.5~7.0
235~275(2)
115~130
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure at 80ºC.
FUJICURE FXR-1030
white powder
4.0~7.0
140~160(4)
135~145
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure>100ºC, Can use diluents.
FUJICURE FXR-1081
white powder
4.0
110~120(2)
115~125
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure at 70ºC.
FUJICURE FXR-1090FA
white powder
5.0
230~250(2)
110~120
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure>100ºC.
FUJICURE FXR-1121
slightly yellow powder
4.0~10.0
165~185(2)
128~138
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure at 80ºC, High Tg with normal epoxy resin.

 

(1)50% Cumulative volume. (Laser diffraction method).

(2)JIS K7237; Potentiometric.

(3)JIS K7234; Ring-and Ball method.

(4)T&K TOKA Method.