Latent Curing Agent
GRADE
Appearance
Average Partical Size (μm)(1)
Amine Value
Softing Point (℃) (3)
Characteristics & Application
Technical
File
FUJICURE FXR-1020
white powder
3.5~7.0
235~275(2)
115~130
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure at 80ºC.
FUJICURE FXR-1030
white powder
4.0~7.0
140~160(4)
135~145
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure>100ºC, Can use diluents.
FUJICURE FXR-1081
white powder
4.0
110~120(2)
115~125
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure at 70ºC.
FUJICURE FXR-1090FA
white powder
5.0
230~250(2)
110~120
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure>100ºC.
FUJICURE FXR-1121
slightly yellow powder
4.0~10.0
165~185(2)
128~138
Epoxy resin mixture maintains good storage stability at R.T., Electronic material adhesive, Curing accelerator to DICY or acid anhydride, Cure at 80ºC, High Tg with normal epoxy resin.
SANCURE LC-125
White powder in fine particle
Average 7.0 μm
232 mg-KOH / g
110℃(The Ring and Ball method )
It can be dispersed easily in epoxy resins, the mixture shows good storage stability at ambient temperature. With moderate heating, the mixture could be cured around 80℃.
(1)50% Cumulative volume. (Laser diffraction method).
(2)JIS K7237; Potentiometric.
(3)JIS K7234; Ring-and Ball method.
(4) T&K TOKA Method.
